SONOSYS Ultraschallsysteme GmbH – located in Neuenbuerg, Germany – is a world leading company in providing Megasonic system solutions for the cleaning of micro and nano structures. 2025 marks the 30-years-in-the-market milestone of the company. Single, double and triple nozzle systems with frequencies ranging up to 9 MHz, submersible transducers and transducers plates in standard and customized sizes as well as face-to-face (FTF) transducers are just some of the products that have been provided over the past decades. And now, the digital era has started with the introduction of the new digital generator which can be fully integrated in existing control networks using Modbus protocol.
Interview with Dr. Hesamedin Ostad, Sales Manager at Sonosys Ultraschallsysteme GmbH.
What are the most common challenges your clients face before turning to your solutions?
Hesamedin Ostad: In the semiconductor industry, the trend toward ever-finer structures presents significant challenges for our clients. As feature sizes continue to shrink, even the smallest particles can cause defects, making particle removal increasingly critical. This requires not only advanced cleaning techniques but also precise control over multiple process parameters.
Clients often struggle with achieving effective particle removal at higher frequencies while simultaneously adapting to new chemical formulations and process recipes. Each parameter—whether it is frequency, chemical composition, temperature or flow dynamics—needs to work in harmony with the others, and finding the right combination can be extremely complex. Before turning to our solutions, many clients face issues such as inconsistent cleaning results, contamination from residual particles, reduced yield and difficulty scaling their processes for newer, finer geometries.
Our expertise lies in helping to optimize these multi-parameter processes to ensure reliable, repeatable results, enabling our clients to meet the stringent cleanliness requirements of modern semiconductor manufacturing.
In what ways do your products directly address these challenges and remove barriers to efficiency?
H.O: Our products are specifically designed to address the increasing complexity and precision requirements in semiconductor cleaning processes. Our Megasonic systems operate in the high-frequency range — with our latest nozzle systems reaching up to 9 MHz. This allows for extremely gentle yet effective particle removal, even at nanoscale dimensions.
In combination with our advanced digital generator, we can finely tune all relevant power and frequency parameters to match the exact process requirements of our customers. This high level of flexibility ensures optimal cleaning results while protecting sensitive structures and minimizing process variability.
A key innovation is our triple-nozzle technology. These nozzles can combine multiple frequencies simultaneously, and each nozzle can be controlled independently. This makes it possible to efficiently remove particles of different sizes and compositions within the same cleaning step, significantly improving overall process efficiency and yield.
Moreover, our transducer plates are designed for various applications and process environments. To enhance chemical resistance and extend the service life, we offer coated versions of these plates, which are essential when working with aggressive or specialized process chemistries.
By integrating these technologies, our systems not only overcome key barriers to cleaning performance, but also enable our clients to achieve higher process stability, throughput, and overall manufacturing efficiency.
What role does innovation (in design, materials, digitalization, automation, etc.) play in transforming client problems into measurable results?
Processes of our clients are seldomly alike—each client operates with highly specific process parameters and chemical formulations. These conditions often require tailor-made material compositions and combinations within our Megasonic systems to ensure optimal performance under the given parameters.
Our approach is driven by a deep commitment to customization and innovation. Every system we design can be adapted in form, size, power, and also materials. Through innovative design and advanced materials engineering, we can align each component precisely with the client’s process environment. This ensures that our systems deliver consistent cleaning performance, chemical compatibility, and mechanical stability, even under demanding process conditions.
Digitalization and automation further enhance this customization by enabling precise process control, real-time monitoring, and data-driven optimization – all possible with our new digital generator. By integrating these technologies, we help our clients translate their complex process requirements into quantifiable improvements in yield, throughput, and reliability.
Ultimately, innovation is not just an add-on—it is the foundation of how we create value. It allows us to bridge the gap between each customer’s unique requirements and the consistent, measurable results they need to stay competitive in a rapidly evolving industry.
How do you ensure a smooth transition from problem recognition to implementing your solution at the client’s site?
H.O: We follow our company motto: „mastering nano-clean together”. It means that our transition from problem recognition to implementation of our Megasonic cleaning solutions at the client’s site begins with a collaborative approach. We place great emphasis on understanding the customer’s specific situation before proposing any technical measures.
Together with the client, we analyze the system setting, the substrates to be cleaned, the particles to be removed, the process chemicals used and other existing challenges, e.g. space requirements or operation temperatures. Based on this information, we create a concept with our clients that defines functional requirements, e.g. Megasonic frequency to be used, integration of our Megasonic systems (nozzles, submersible transducers, transducer plates or else) into the system setting of our clients, as well implementation steps. This ensures that the proposed solution is both technically sound and strategically aligned with the customer’s goals.
Our products and systems are designed to be modular and adaptable, as our clients’ requirements are often unique. Although we have for example standard sized submersible transducers for standard substrate sizes (e.g. 4”, 6” or 8” wafers), we are able to scale up and down to meet specific needs.
Do you adapt your products to specific industries or customer needs, and if so, how?
We continuously adapt our products to meet the specific requirements of different industries and individual customer applications. Our technology is highly versatile and can be customized both in design and performance to achieve optimal results across a wide range of fields.
For example, in the food industry, our Megasonic transducer plates are used in extraction processes such as palm oil or olive oil production, where they significantly increase yield and process efficiency. This improvement not only enhances product quality but also delivers a considerable economic benefit to our customers.
In other sectors, such as the optics industry, we develop solutions tailored to handle large and sensitive substrates that require precise, gentle cleaning. We also collaborate frequently with research institutions, which explore entirely new application areas — for instance, in the plastics industry, or in laboratory research on biological tissues, where our technology supports innovative and highly specialized studies
How do your solutions not only solve immediate challenges but also support long-term operational efficiency and sustainability?
H.O: One of the key aspects of this is exceptional product longevity — our systems are engineered for durability, reliability, and consistent performance even under demanding operating conditions.
In addition, the modular design of our generators plays a crucial role in supporting sustainability. Each unit is designed in a way that allows for easy replacement of individual modules rather than complete system exchanges. This approach significantly extends the overall product lifetime, reduces electronic waste, and minimizes downtime during maintenance.
The same philosophy applies to our nozzle systems, transducer plates or submersible transducers. All components are developed with a strong focus on repairability and serviceability, allowing users to maintain peak performance over many years while keeping maintenance costs and environmental impact low.
What future client challenges do you anticipate, and how are your products evolving to address them?
H.O: In the semiconductor industry, we are observing a continuous trend toward miniaturization — components are becoming smaller, and consequently, the particles that need to be removed during cleaning are also decreasing in size. This development presents a major challenge: achieving effective cleaning performance without causing any damage to highly sensitive surfaces.
To address this, cleaning processes require ever higher Megasonic frequencies and extremely precise control of power output. Conventional systems often struggle to provide the necessary sensitivity and fine-tuning at these advanced performance levels.
Our products are evolving precisely to meet these demands. With our digital generator technology, we enable exceptionally fine power adjustments — down to 1% increments — ensuring optimal cleaning intensity for even the most delicate applications. Additionally, our Megasonic nozzles, now available with frequencies of up to 9 MHz, provide the high-frequency precision required to remove nanoscale contaminants safely and efficiently.
By combining these innovations, we equip our customers with the flexibility and control needed to master future semiconductor cleaning challenges — maintaining both efficiency and surface integrity as component sizes continue to shrink.
