Optim Wafer Services offers high quality bespoke engineering services to silicon or other wafer & substrates.
What are the main areas of activity of the company?
OPTIM provides the following engineering services on wafers and other substrates – Thinning, Polishing, Grinding, Taiko, CMP, Edge trimming, Chamfering, Rounding, Re-sizing, Dicing, DBG, Cleaning & Reclaim of wafers from 2” to 12” diameters or other substrate shapes.
What’s the news about new products/services?
OPTIM will be attending SEMICON Europa in November, held at the Messe Munich. We can be found at booth C2.354
What are the ranges of products/services?
OPTIM has in excess ~100-man years of wafer processing/engineering experience. We can combine one or more of our capabilities to make one off requests, or develop processes/products by integrating those capabilities. We can offer prototyping, low or high-level production volumes.
What is the state of the market where you are currently active?
The wafer reclaim market in 2024 is less demanding than the previous 3 years following the COVID epidemic with the automotive sector being particularly affected. This lower demand has a direct impact on the volume of reclaim wafers needed by wafer fabs.
The bespoke engineering services part of OPTIM’s business is still buoyant with regular enquiries from new and returning customers.
